|
BGA/LCC/QFN Repair Tools
 When a PCB has a defective SMT device it is necessary to remove and replace the component. There are two common repair methods: (1) Solder paste is printed on the PCB pads with a Mini-Stencil and the new device placed into the tacky solder paste. (2) Solder paste is printed on the package (QFN / LCC) leads or BGA balls of the package and the package is then placed on the PCB. This tool is referred to as the BGA/LCC/QFN Repair Tool.
The BGA/LCC/QFN Repair Tool is compatible with the Air-Vac vacuum pick and place repair tool. The following sequence demonstrates how this tool works. A unversal base system consists of a Stencil Holding Fixture and a Package Hold-Down Fixture. A metal foil with a cavity to hold the package is easily snapped in place over the 4 tooling pins, two of which are puller pins, in a matter of seconds. The stencil used to print solder paste on the pads is snapped into place using the same pins. The package is placed in the holding cavity and the Hold-Down Fixture is snapped into place holding the package firmly against the stencil. Solder paste is printed onto the package, the Hold-Down Fixture removed, and the package is lifted out of its nest with a vacuum tool and placed on the PCB.
Download product sheet.
Advantages
- A single universal tool can be used for multiple packages.
- Stencils and package holding foils, required for each unique package (BGA/LCC/QFN), are compatible with the Universal tool.
- Set-up time and change over time for new packages is minimal (a matter of seconds to install a new stencil and Package Holding tool).
|
view All Products |
|
Photo Stencil is a proud supporter of the 2008 U.S. Senior Open
