Events, Tradeshows, & Technical Presentations


IPC APEX Expo - San Diego
February 19 - 21, 2013

Booth 1215

Join thousands of colleagues from more than 50 countries at our industry's premier event featuring advanced and emerginAPEX VIP Passg technologies in printed board design and manufacturing, electronics assembly and test.

In 2013, be part of the new focus on printed electronics and learn from the experts at Photo Stencil presenting at these key sessions!

PRESENTING at APEX Session S27 Printing I
Wednesday, February 20, 9:00 AM - 10:00 AM

Two Print Stencils Process
Speaker: Dr. William Coleman Ph.D., Photo Stencil

The Two print stencils process has been a very useful tool in SMT Assembly and Package Assembly. It is also useful in Assemblies that require mixed technologies; including SMT / Through Hole, SMT / Glue attach components, Packages requiring die attach / SMT assembly. The concept is to print with a first print stencil which is thinner than the second print stencil. The second print stencil has relief pockets formed anywhere that the first stencil printed. It is useful for several applications:

  • Printing Solder Paste for Through-Hole and SMT
  • Printing Glue and Solder Paste
  • Printing Flux and Solder Paste
  • Printing Solder Paste for SMT and RF Shields
  • Printing Reservoir Solder Paste for multi-level boards
  • Printing Solder Paste and Reservoir Flux

PRESENTING at APEX Session S32 Printing II
Thursday, February 21, 10:15 AM - 12:00 PM

Printing and Assembly Challenges for QFN Devices
Speaker: Rachel Miller-Short, Photo Stencil

This presentation will discuss the assembly challenges of QFN and DFN devices. Solutions to the challenges regarding ground plane design, to eliminate package floating, aperture design, stencil selection, and QFN repair will be presented. Aperture deign recommendations will consider various solder mask designs including SMD, NSMD, and NSMD Window, as well as Area Ratio considerations and stencil technology solutions.

APEX POSTER Session P-06
Wednesday, February 20, 3:30 PM - 4:30 PM

Printing and Assembly Challenges for QFN Devices
Speaker: Dr. William Coleman Ph.D., Photo Stencil

QFN (quad flatpack, no leads) and DFN (dual flatpack, no lead) are becoming more popular in new component releases. Their very small form factor allows smaller packages, better grounding, and better heat sink thermal properties compared to other SMT packages.

  • Benefits and Challenges
  • Stencil and PCB Design Considerations
  • QFN Repair