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ELECTROFORMED Stencil

AMTX E-FAB® electroformed stencils have set the standard for the SMT industry with superior printing characteristics and lower defect rates. Efab Stencils

The AMTX E-FAB electroformed stencil is used extensively for (20 mil to 12 mil pitch) SMT applications.
It is also used for µBGA's, Flip Chip, and Wafer Bumping (12 mil to 6 mil pitch). Photo Stencil is the exclusive manufacturer of the patented AMTX E-FAB stencil (including all improvements since 1998).

Download product sheet.

Click here to review the Electroforming Process.

Advantages

Smooth, Trapezoidal Sidewalls: Maximizes solder paste release.

Unsurpassed Tensile Strength and Hardness: Increases stencil life.

Nickel Surface Properties: Low-surface energy enhances solder paste release.

Thickness: Available in 1 to 12 mil thicknesses with 0.1 mil increments.

Precise Aperture Sizes: Post-processing size compensation not required.

Higher Process Yields: Superior printing characteristics and lower defect rates guarantee high process yields.

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Photo Stencil offers process seminars prior to 2008 U.S. Senior Open

Seminar attendees are invited to attend the tournament as guests of the company during the week of the golf championship in Colorado Spings. Read full press release here.

Photo Stencil is a proud supporter of the 2008 U.S. Senior Open

Players

Event Information

Running out of storage space for your SMT stencils?

Space Saver Frame offer the perfect solution increasing your stencil storage capacity by a factor of three.

Ask The Experts

Need help with your SMT problems? Dr. Bill Coleman will be glad to answer any questions... more info