Presentation: Stencil Design for Wafer Level Ball Drop and Flip Chip Assembly

IWLPC Wafer-level Packaging ConferenceIWLPC Conference & Expo


October 14, 2015, 5:00 PM

Monterey Room, Session 10
San Jose, California USA

Sue Holmes will be discussing stencil design for wafer level ball drop and flip chip assembly in the WLP/Monterey Room, Session 10.

Click Here for details or to register for your IWLPC exhibits pass.

IWLPC Stencil Expo Pass