Presentation: Stencil Design for Wafer Level Ball Drop and Flip Chip Assembly


IWLPC Wafer-level Packaging ConferenceIWLPC Conference & Expo

 

October 14, 2015, 5:00 PM

Monterey Room, Session 10
San Jose, California USA

Sue Holmes will be discussing stencil design for wafer level ball drop and flip chip assembly in the WLP/Monterey Room, Session 10.

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IWLPC Stencil Expo Pass