Presentation: Stencil Design for Wafer Level Ball Drop and Flip Chip Assembly
October 14, 2015, 5:00 PM
Monterey Room, Session 10
San Jose, California USA
Sue Holmes will be discussing stencil design for wafer level ball drop and flip chip assembly in the WLP/Monterey Room, Session 10.
Click Here for details or to register for your IWLPC exhibits pass.