 IPC APEX Expo
San Diego Convention Center
February 28 - March 1
Featuring advanced and emerging technologies in printed board design and manufacturing, electronics assembly and test. Find new suppliers with new solutions and connect with colleagues from around the world.
Connect with Photo Stencil LLC at our booth number 2419.
Session S06 Printing I
Tuesday, February 28, 2012,
3:15 PM - 4:45 PM
Efficient printing is crucial to achieving a high yield in manufacturing, but with new packages being introduced all the time and package footprints constantly decreasing in size, manufacturing is continually challenged to optimize and re-optimize the paste printing process. The session will cover the stencil design and coating choices that are being developed to ensure the printing process stays a high-output/zero-defect process for today’s new packages and small footprints.
- See Stencil Printing of Small Apertures with Dr. William Coleman, Photo Stencil LLC
Committee 5-21e Solder Stencil Task Group
Mon, Feb 27, 2012 - 10:00 AM to 12:00 PM
This group is celebrating the publication of revision B of IPC-7525. This guide assists users in selecting stencil apertures for solder paste printing, including support for use with lead-free alloys.
- See Dr. William Coleman, Photo Stencil LLC (Co-chair)
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