Applications
1) Printing of glue on the backside of a PCB for attaching chip components only to the PCB prior to wave soldering.
2) Printing glue on the backside of a PCB for attaching both chip components and leaded devices prior to wave soldering.
3) The same application as (2) above, but with clinched connectors protruding up through the PCB.
4) Printing solder paste followed by printing glue on the back side of a PCB for attaching chip components only to the PCB prior to wave soldering or reflow. The stencil tool for this application is a “Two Print Stencil.” The first stencil is normally 6 mil thick and prints solder paste on the chip component pads. The second stencil is 12 to 20 mils thick and is used to print the glue between the chip component pads.
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Advantages
Freedom of Glue Aperture Design: Unlike plastic stencils with circular apertures only, rectangles, oblongs, and circles are available in the Metal Glue Reservoir Stencil.
No ESD Issues: ESD is not an issue as with plastic stencils.
Robust Glue Printing Process: Provides the same robust glue printing process that laser metal stencils have provided for years for chip component glue applications.
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Stencil printing of glue on the backside of PCBs is much faster and more cost effective than dispensing glue. It also provides a tighter distribution of glue volume and glue height compared to dispensing. Photo Stencil has devoted considerable time and research to improve the process time and repeatability of using stencils for printing glue. The result is the patented Metal Glue Reservoir Stencil!
Photo Stencil is a proud supporter of the 2008 U.S. Senior Open
