Excellent Print Performance: The fine pitch apertures (typically 20 mil pitch QFP’s or smaller as well as BGA’s of 30 mil pitch or less) are Laser-Cut to ensure dimensional accuracy and aperture wall quality, providing excellent print performance. The remaining apertures (25 mil pitch and above) are chemically etched providing more than adequate print performance for these larger apertures.
Yields Excellent Registration: H-FAB Stencils are available using Alloy 42 metal. Step Stencils and Relief Stencils are available for all Hybrid Stencils. Photo Stencil’s proprietary registration process yields excellent registration between the chemically-etched and the laser-cut apertures.
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Improved Aperture Quality: Electropolish post-processing of the H-FAB Stencil will improve aperture quality of both the Laser-cut and the chemically-etched apertures. Nickel plating is also available for H-FAB Stencils and is recommended for 16 mil pitch and below and for µBGA applications.
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The Hybrid Stencil (H-FAB®) combines Laser-Cut and Chem-Etch technologies in a single stencil. This technology is for applications having a small number of fine pitch apertures (500 to 1500) and a large number of total apertures (6,000 to 12,000). 
Photo Stencil is a proud supporter of the 2008 U.S. Senior Open
