AMTX™ - Electroformed Stencils

For SMT, BGA, Flipchip, and Wafer Bumping Applications

AMTX electroformed stencils have set the standard for the SMT industry with superior printing characteristics and lower defect rates.

The AMTX electroformed stencil is used extensively for (20 mil to 12 mil pitch) SMT applications.

It is also used for µBGAs, Flip Chip, and Wafer Bumping (12 mil to 6 mil pitch). Photo Stencil is the exclusive manufacturer of the patented AMTX electroformed stencil (including all improvements since 1998).

Advantages

• Smooth, Trapezoidal Sidewalls: Maximizes solder paste release.
• Unsurpassed Tensile Strength and Hardness: Increases stencil life.
• Nickel Surface Properties: Low-surface energy enhances solder paste release.
• Thickness: Available in 1 to 12 mil thicknesses with 0.1 mil increments.
• Precise Aperture Sizes: Post-processing size compensation not required.
• Higher Process Yields: Superior printing characteristics and lower defect rates guarantee high process yields.