NiEX™ Electroformed Stencils - Hard Nickel

Available in 1 to 3 mil thicknesses

NiEX™ electroformed stencils use the same proprietary process as our market leading AMTX™ stencils. The NiEX™ stencil has a higher Knoop Hardness (HK) than our standard AMTX product for those very thin less than .003 applications such as wafer bumping or flux printing.

Electroformed Stencils - Advantages:

• Smooth, Trapezoidal Sidewalls: Maximizes material release
• Unsurpassed Tensile Strength and Hardness: Increases stencil life
• Nickel Surface Properties: Low-surface energy enhances solder paste release
• Thickness: Available in 1 to 3 mil thicknesses with 0.1 mil increments
• Precise Aperture Sizes: Post-processing size compensation not required
• Higher Process Yields: Superior printing characteristics and lower defect rates guarantee high process yields