Technical Papers

Below you will find links to many different technical whitepapers that Dr. Bill Coleman is the Author of. If you would like a copy of these white papers click on the link and you can download a PDF of the document. If you have any questions please feel free to contact us.

The Small Component Printing Challenge
Duplicate Exact from the Stencil Perspective
Stencil Controls
Technology Drives New Stencil Applications
Rework Challenges, Rework Solutions
Creative Solutions to Stencil Printing Challenges
The BGA/QFN Repair Process
Critical Parameters for Stencil Performance
Intrusive Reflow of Lead-free Solder Paste
Intrusive Reflow of Lead-free Solder Paste, Part II
The Evolution of Stencil Technology
Intrusive Reflow Challenges Wave Soldering
Electroformed vs. Laser-cut: A Stencil Performance Study
Choosing a Stencil
Step 4: Printing
Stencil Design for Mixed-technology Placement & Reflow
Adhesive Deposition