Seminar: Stencil Technology & Design

 

Course Description

Electroformed StencilsThis seminar provides information on stencil printing performance and how stencil technology and design influences printing performance. Much of the data presented was generated during print performance studies at independent test laboratories. Solder volume and solder volume dispersion are the key data used to predict print performance and overall SMT assembly yields/defect rates.

Stencil designs for a variety of applications will be reviewed in detail. SMT Assembly Tools (Wave Solder Pallets, Process Carriers etc.) and SMT Assembly Inspection Tools will also be covered. A complete workbook of all information including reference information will be provided to all attendees. The class is held at the Photo Stencil, Colorado Springs facility or customer sites.

View the topics here or download the full Agenda.

Who Should Attend

This is a hands-on workshop for process engineers, quality control engineers, supervisors, managers, and technicians who are involved with solder-paste screen printing, process control, solder paste selection, and optimizing the assembly process.

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Presenter: Dr. William E. Coleman, Ph.D.

For nearly 30 years, Dr. Coleman has been providing his experience and knowledge to the electronic interconnect industry. Among his contributions, he was instrumental in establishing the standard IPC 7525 Stencil Design Guidelines and was the original chair of, and over the years has continued to chair or co-chair, the 5-21e Solder Stencil Task Group Committee.

Dr. Coleman recently received two distinguished awards from IPC, the IPC Presidents Award and the Committee Leadership Award. The highly respected IPC Presidents Award is given for ongoing leadership and significant contributions of time and talent made to the association as well as the electronics interconnect industry. The Committee Leadership Award was in recognition of Coleman's co-chairmanship of the 5-21e Solder Stencil Task Group that developed and completed the Stencil Design Guidelines IPC-7525B. He is a 2-time winner of IPC's Committee Service Award. Coleman has numerous patents under his name and serves on university and industry boards of directors. He received a PhD in physics from West Virginia University. Contact Dr. William E. Coleman at (719) 535-8528 or at bcoleman@photostencil.com.