IPC PRESIDENT'S AWARD and BEST POSTER WINNER
Dr. William Coleman presents Poster Paper "Two Print Stencils"
IPC APEX EXPO 2014
Meet Dr. Coleman, March 26 3:30 PM
So. Pacific, Room F
Have you ever needed to print on a multilevel PCB?
The Two Print Stencils process has been a very useful tool in SMT Assembly and Package Assembly. It is also useful in Assemblies that require mixed technologies; including SMT / Through Hole, SMT / Glue attach components, Packages requiring die attach / SMT assembly. The concept is to print with a first print stencil which is thinner than the second print stencil. The second print stencil has relief pockets formed anywhere that the first stencil printed. Watch Video ...